Købe AT80251G2D-SLSUM med BYCHPS
Køb med garanti
AT80251G2D-SLSUM
- Varenummer:
- AT80251G2D-SLSUM
- Fabrikant:
- Micrel / Microchip Technology
- Beskrivelse:
- IC MCU 8BIT ROMLESS 44PLCC
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13445 Pieces
- Datablad:
- AT80251G2D-SLSUM.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for AT80251G2D-SLSUM, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til AT80251G2D-SLSUM via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Supply (Vcc / Vdd): | 4.5 V ~ 5.5 V |
|---|---|
| Leverandør Device Package: | 44-PLCC (16.59x16.59) |
| Fart: | 24MHz |
| Serie: | 8x251 |
| RAM-størrelse: | 1K x 8 |
| Programhukommelsestype: | ROMless |
| Programhukommelsesstørrelse: | - |
| tilbehør: | POR, PWM, WDT |
| Emballage: | Tube |
| Pakke / tilfælde: | 44-LCC (J-Lead) |
| Oscillator Type: | Internal |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Antal I / O: | 32 |
| Fugtfølsomhedsniveau (MSL): | 2 (1 Year) |
| Producentens varenummer: | AT80251G2D-SLSUM |
| Udvidet beskrivelse: | C251 8x251 Microcontroller IC 8/16-Bit 24MHz ROMless 44-PLCC (16.59x16.59) |
| EEPROM-størrelse: | - |
| Beskrivelse: | IC MCU 8BIT ROMLESS 44PLCC |
| Datakonvertere: | - |
| Core Size: | 8/16-Bit |
| Core Processor: | C251 |
| Connectivity: | EBI/EMI, I²C, Microwire, SPI, UART/USART |
| Email: | [email protected] |
Relaterede dele til AT80251G2D-SLSUM
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
AT80251G2D-3CSUM | Microchip Technology | IC MCU 8BIT ROMLESS 40PDIL | Forespørgsel |
 |
AT80251G2D-RLTUM | Microchip Technology | IC MCU 8BIT ROMLESS 44VQFP | Forespørgsel |
|
AT80251G2D-SLSUL | Microchip Technology | IC MCU 8BIT ROMLESS 44PLCC | Forespørgsel |
|
AT80251G2D-SLRUM | Microchip Technology | IC MCU 8BIT ROMLESS 44PLCC | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers