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B32776T5855K
- Varenummer:
- B32776T5855K
- Fabrikant:
- EPCOS
- Beskrivelse:
- CAP FILM 8.5UF 10% 575VDC RADIAL
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15746 Pieces
- Datablad:
- B32776T5855K.pdf
Introduktion
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specifikationer
| Spændingsvurdering - DC: | 575V |
|---|---|
| Spændingsbedømmelse - AC: | - |
| Tolerance: | ±10% |
| Afslutning: | PC Pins |
| Størrelse / Dimension: | - |
| Serie: | B32776 |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial |
| Andre navne: | 495-4571 B32776T5855K000 |
| Driftstemperatur: | -40°C ~ 105°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | B32776T5855K |
| Blyafstand: | 1.476" (37.50mm) |
| Højde - Siddende (Max): | - |
| Funktioner: | Long Life |
| Udvidet beskrivelse: | 8.5µF ±10% Film Capacitor 575V Polypropylene (PP), Metallized Radial |
| ESR (Equivalent Series Resistance): | - |
| Dielektrisk materiale: | Polypropylene (PP), Metallized |
| Beskrivelse: | CAP FILM 8.5UF 10% 575VDC RADIAL |
| kapacitans: | 8.5µF |
| Applikationer: | DC Link, DC Filtering |
| Email: | [email protected] |
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B32776G106K | EPCOS (TDK) | CAP FILM 10UF 10% 1.1KVDC RADIAL | Forespørgsel |
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B32776E5356K000 | EPCOS (TDK) | CAP FILM 35UF 10% 575VDC RADIAL | Forespørgsel |
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B32776T5126K | EPCOS (TDK) | CAP FILM 12UF 10% 575VDC RADIAL | Forespørgsel |
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B32776E5256K000 | EPCOS (TDK) | CAP FILM 25UF 10% 575VDC RADIAL | Forespørgsel |
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B32776E5456K000 | EPCOS (TDK) | CAP FILM 45UF 10% 575VDC RADIAL | Forespørgsel |
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B32776G9156K000 | EPCOS (TDK) | CAP FILM 15UF 10% 900VDC RAD 4LD | Forespørgsel |
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B32776T9505K000 | EPCOS (TDK) | CAP FILM 5UF 10% 900VDC RADIAL | Forespørgsel |
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Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
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- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
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- Embedded World 2019: Get the full Electronics Weekly Guide
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- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers