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B43564A2477M
- Varenummer:
- B43564A2477M
- Fabrikant:
- EPCOS
- Beskrivelse:
- CAP ALUM 470UF 20% 250V SCREW
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 18940 Pieces
- Datablad:
- B43564A2477M.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for B43564A2477M, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til B43564A2477M via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsbedømmelse: | 250V |
|---|---|
| Tolerance: | ±20% |
| Overflade Mount Land Størrelse: | - |
| Størrelse / Dimension: | - |
| Serie: | B43564 |
| Ripple Current: | - |
| Polarisering: | Polar |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Can - Screw Terminals |
| Andre navne: | B43564A2477M000 |
| Driftstemperatur: | -25°C ~ 85°C |
| Monteringstype: | Chassis Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 18 Weeks |
| Producentens varenummer: | B43564A2477M |
| Levetid @ Temp.: | 15000 Hrs @ 85°C |
| Blyafstand: | - |
| Impedans: | - |
| Højde - Siddende (Max): | - |
| Udvidet beskrivelse: | 470µF 250V Aluminum Capacitors Radial, Can - Screw Terminals 15000 Hrs @ 85°C |
| ESR (Equivalent Series Resistance): | - |
| Beskrivelse: | CAP ALUM 470UF 20% 250V SCREW |
| kapacitans: | 470µF |
| Applikationer: | General Purpose |
| Email: | [email protected] |
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B43564A2478M | EPCOS (TDK) | CAP ALUM 4700UF 20% 250V SCREW | Forespørgsel |
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B43564A2229M | EPCOS (TDK) | CAP ALUM 22000UF 20% 250V SCREW | Forespørgsel |
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B43564A2158M | EPCOS (TDK) | CAP ALUM 1500UF 20% 250V SCREW | Forespørgsel |
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B43564A228M | EPCOS (TDK) | CAP ALUM 2200UF 20% 400V SCREW | Forespørgsel |
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B43564A2109M7 | EPCOS (TDK) | CAP ALUM 10000UF 20% 250V SCREW | Forespørgsel |
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B43564A2278M | EPCOS (TDK) | CAP ALUM 2700UF 20% 250V SCREW | Forespørgsel |
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B43564A2159M3 | EPCOS (TDK) | CAP ALUM 15000UF 20% 250V SCREW | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers