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B57364S2259A2
- Varenummer:
- B57364S2259A2
- Fabrikant:
- EPCOS
- Beskrivelse:
- ICL 2.5 OHM 20% 11A 21MM
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16165 Pieces
- Datablad:
- B57364S2259A2.pdf
Introduktion
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specifikationer
| Tolerance: | ±20% |
|---|---|
| Serie: | - |
| R @ Current: | - |
| R 25 ° C: | 2.5 Ohm |
| Emballage: | Bulk |
| Andre navne: | 495-4158 B57364S 2259A 002 B57364S2259A002 |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | B57364S2259A2 |
| Blyafstand: | 0.295" (7.50mm) |
| Udvidet beskrivelse: | Inrush Current Limiter 2.5 Ohm Ohm ±20% 0.825" (21mm) |
| Diameter: | 0.825" (21mm) |
| Beskrivelse: | ICL 2.5 OHM 20% 11A 21MM |
| Strøm - Stabil tilstand Maks: | 11A |
| Godkendelser: | UL |
| Email: | [email protected] |
Relaterede dele til B57364S2259A2
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
B57364S259M | EPCOS (TDK) | ICL 2.5 OHM 20% 11A 21MM | Forespørgsel |
|
B57364S2100A2 | EPCOS (TDK) | ICL 10 OHM 20% 7.5A 21MM | Forespørgsel |
|
B57364S2209A2 | EPCOS (TDK) | ICL 2 OHM 20% 12A 21MM | Forespørgsel |
|
B57364S2109A2 | EPCOS (TDK) | ICL 1 OHM 20% 16A 21MM | Forespørgsel |
|
B57364S2509A2 | EPCOS (TDK) | ICL 5 OHM 20% 8.5A 21MM | Forespørgsel |
|
B57364S121M | EPCOS (TDK) | ICL 120 OHM 20% 21MM | Forespørgsel |
|
B57364S259M51 | EPCOS (TDK) | ICL 2.5 OHM 20% 11A 21MM | Forespørgsel |
|
B57364S209M51 | EPCOS (TDK) | ICL 2 OHM 20% 12A 21MM | Forespørgsel |
|
B57364S121M51 | EPCOS (TDK) | ICL 120 OHM 20% 21MM | Forespørgsel |
|
B57364S100M51 | EPCOS (TDK) | ICL 10 OHM 20% 7.5A 21MM | Forespørgsel |
|
B57364S2409A2 | EPCOS (TDK) | ICL 4 OHM 20% 9.5A 21MM | Forespørgsel |
|
B57364S209M | EPCOS (TDK) | ICL 2 OHM 20% 12A 21MM | Forespørgsel |
|
B57364S109M51 | EPCOS (TDK) | ICL 1 OHM 20% 16A 21MM | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers