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B82730G3162A020
- Varenummer:
- B82730G3162A020
- Fabrikant:
- EPCOS
- Beskrivelse:
- CMC 1MH 1.6A 2LN
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15064 Pieces
- Datablad:
- B82730G3162A020.pdf
Introduktion
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specifikationer
| Spændingsvurdering - DC: | - |
|---|---|
| Spændingsbedømmelse - AC: | 300V |
| Størrelse / Dimension: | 0.650" L x 0.591" W (16.50mm x 15.00mm) |
| Serie: | B82730 |
| Vurderinger: | - |
| Emballage: | Tray |
| Pakke / tilfælde: | Horizontal, 4 PC Pin |
| Andre navne: | 495-75369 B82730G3162A 20 B82730G3162A020-ND B82730G3162A20 |
| Driftstemperatur: | -40°C ~ 125°C |
| Antal linjer: | 2 |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 22 Weeks |
| Producentens varenummer: | B82730G3162A020 |
| Induktans @ Frekvens: | 1mH @ 100kHz |
| Impedans @ Frekvens: | - |
| Højde (Max): | 0.472" (12.00mm) |
| Filter Type: | Power Line |
| Funktioner: | - |
| Udvidet beskrivelse: | 1mH @ 100kHz 2 Line Common Mode Choke Through Hole 1.6A DCR 160 mOhm (Typ) |
| Beskrivelse: | CMC 1MH 1.6A 2LN |
| DC-modstand (DCR) (Max): | 160 mOhm (Typ) |
| Nuværende vurdering (Max): | 1.6A |
| Godkendelser: | UR, VDE |
| Email: | [email protected] |
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B82730U3102A20 | EPCOS (TDK) | CMC 1.8MH 1A 2LN TH | Forespørgsel |
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B82730U3451A20 | EPCOS (TDK) | CMC 10MH 450MA 2LN TH | Forespørgsel |
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B82730U3601A20 | EPCOS (TDK) | CMC 4.7MH 600MA 2LN TH | Forespørgsel |
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B82730G3751A020 | EPCOS (TDK) | CMC 3.9MH 750MA 2LN | Forespørgsel |
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B82730U3162A20 | EPCOS (TDK) | CMC 1MH 1.6A 2LN TH | Forespørgsel |
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B82730U3951A20 | EPCOS (TDK) | CMC 2.2MH 950MA 2LN TH | Forespørgsel |
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B82730G3951A020 | EPCOS (TDK) | CMC 2.2MH 950MA 2LN | Forespørgsel |
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B82730U3751A20 | EPCOS (TDK) | CMC 3.9MH 750MA 2LN TH | Forespørgsel |
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B82730G3262A020 | EPCOS (TDK) | CMC 330UH 2.6A 2LN | Forespørgsel |
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B82730G3451A020 | EPCOS (TDK) | CMC 10MH 450MA 2LN | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers