Købe BCAP0310 P270 T10 med BYCHPS
Køb med garanti
BCAP0310 P270 T10
- Varenummer:
- BCAP0310 P270 T10
- Fabrikant:
- Maxwell Technologies, Inc.
- Beskrivelse:
- CAP 310F 2.7V THROUGH HOLE
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15624 Pieces
- Datablad:
- BCAP0310 P270 T10.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for BCAP0310 P270 T10, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til BCAP0310 P270 T10 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 2.7V |
|---|---|
| Tolerance: | - |
| Afslutning: | Through Hole |
| Størrelse / Dimension: | 1.311" Dia (33.30mm) |
| Serie: | BC |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Can |
| Andre navne: | 108755 1182-1015 BCAP0310P270T10 |
| Driftstemperatur: | -40°C ~ 65°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 6 Weeks |
| Producentens varenummer: | BCAP0310 P270 T10 |
| Levetid @ Temp.: | 1500 Hrs @ 65°C |
| Blyafstand: | 0.472" (12.00mm) |
| Højde - Siddende (Max): | 2.421" (61.50mm) |
| Udvidet beskrivelse: | 310F (EDLC) Supercapacitor 2.7V Radial, Can 2.2 mOhm 1500 Hrs @ 65°C |
| ESR (Equivalent Series Resistance): | 2.2 mOhm |
| Beskrivelse: | CAP 310F 2.7V THROUGH HOLE |
| kapacitans: | 310F |
| Email: | [email protected] |
Relaterede dele til BCAP0310 P270 T10
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers