Købe BM63363S-VC med BYCHPS
Køb med garanti
BM63363S-VC
- Varenummer:
- BM63363S-VC
- Fabrikant:
- LAPIS Semiconductor
- Beskrivelse:
- IC IPM 600V IGBT SW 25HSDIP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13268 Pieces
- Datablad:
- BM63363S-VC.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for BM63363S-VC, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til BM63363S-VC via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Isolering: | 1500Vrms |
|---|---|
| Spænding: | 600V |
| Type: | IGBT |
| Serie: | - |
| Pakke / tilfælde: | 25-PowerDIP Module (1.327", 33.70mm) |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 13 Weeks |
| Producentens varenummer: | BM63363S-VC |
| Udvidet beskrivelse: | Power Driver Module IGBT 3 Phase Inverter 600V 10A 25-PowerDIP Module (1.327", 33.70mm) |
| Beskrivelse: | IC IPM 600V IGBT SW 25HSDIP |
| Nuværende: | 10A |
| Konfiguration: | 3 Phase Inverter |
| Email: | [email protected] |
Relaterede dele til BM63363S-VC
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
BM63363S-VA | Rohm Semiconductor | IC IPM 600V IGBT SW 25HSDIP | Forespørgsel |
 |
PM75B4L1C060 | Powerex Inc. | MOD IPM H-BRIDGE L1 75A 600V | Forespørgsel |
 |
BM63364S-VC | Rohm Semiconductor | IC IPM 600V IGBT SW 25HSDIP | Forespørgsel |
|
BM63364S-VA | Rohm Semiconductor | IC IPM 600V IGBT SW 25HSDIP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog