Købe CDBC360-G med BYCHPS
Køb med garanti
CDBC360-G
- Varenummer:
- CDBC360-G
- Fabrikant:
- Comchip Technology
- Beskrivelse:
- DIODE SCHOTTKY 60V 3A DO214AB
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19052 Pieces
- Datablad:
- CDBC360-G.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for CDBC360-G, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til CDBC360-G via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Videresend (Vf) (Max) @ Hvis: | 700mV @ 3A |
|---|---|
| Spænding - DC-omvendt (Vr) (Max): | 60V |
| Leverandør Device Package: | DO-214AB, (SMC) |
| Fart: | Fast Recovery = 200mA (Io) |
| Serie: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | DO-214AB, SMC |
| Andre navne: | 641-1122-2 CDBC360G MBRS360 |
| Driftstemperatur - Junction: | 125°C (Max) |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 10 Weeks |
| Producentens varenummer: | CDBC360-G |
| Udvidet beskrivelse: | Diode Schottky 60V 3A Surface Mount DO-214AB, (SMC) |
| Diodetype: | Schottky |
| Beskrivelse: | DIODE SCHOTTKY 60V 3A DO214AB |
| Nuværende - Reverse Lækage @ Vr: | 500µA @ 60V |
| Nuværende - Gennemsnitlig Rectified (Io): | 3A |
| Kapacitans @ Vr, F: | - |
| Email: | [email protected] |
Relaterede dele til CDBC360-G
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers