Købe CM7560-564 med BYCHPS
Køb med garanti
CM7560-564
- Varenummer:
- CM7560-564
- Fabrikant:
- API Delevan
- Beskrivelse:
- CMC 560UH 3.5A 2LN TH
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 15360 Pieces
- Datablad:
- CM7560-564.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for CM7560-564, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til CM7560-564 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering - DC: | - |
|---|---|
| Spændingsbedømmelse - AC: | - |
| Størrelse / Dimension: | 1.071" L x 0.858" W (27.20mm x 21.80mm) |
| Serie: | CM7560 |
| Vurderinger: | - |
| Emballage: | Bulk |
| Pakke / tilfælde: | Vertical, 4 PC Pin |
| Andre navne: | CM7560-564 BULK 25 |
| Driftstemperatur: | -55°C ~ 125°C |
| Antal linjer: | 2 |
| Monteringstype: | Through Hole |
| Producentens varenummer: | CM7560-564 |
| Induktans @ Frekvens: | 560µH @ 1kHz |
| Impedans @ Frekvens: | - |
| Højde (Max): | 0.861" (21.86mm) |
| Filter Type: | - |
| Funktioner: | - |
| Udvidet beskrivelse: | 560µH @ 1kHz 2 Line Common Mode Choke Through Hole 3.5A DCR 35 mOhm |
| Beskrivelse: | CMC 560UH 3.5A 2LN TH |
| DC-modstand (DCR) (Max): | 35 mOhm |
| Nuværende vurdering (Max): | 3.5A |
| Godkendelser: | - |
| Email: | [email protected] |
Relaterede dele til CM7560-564
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers