Købe DBR71210-HR med BYCHPS
Køb med garanti
DBR71210-HR
- Varenummer:
- DBR71210-HR
- Fabrikant:
- Cynergy3
- Beskrivelse:
- RELAY REED SPST-NC 3A 12V
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12178 Pieces
- Datablad:
- DBR71210-HR.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for DBR71210-HR, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til DBR71210-HR via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Tænd for spænding (maks.): | 9 VDC |
|---|---|
| Sluk spænding (Min): | 1.25 VDC |
| Afslutningsstil: | PC Pin |
| Skiftespænding: | 1000VAC, 1000VDC - Max |
| Serie: | D-HR |
| Udgivelsestid: | 3ms |
| Relæ Type: | Reed |
| Emballage: | Tray |
| Andre navne: | 725-1386 DBR71210-HR-ND |
| Driftstemperatur: | -20°C ~ 70°C |
| Brug tid: | 2ms |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 8 Weeks |
| Producentens varenummer: | DBR71210-HR |
| Funktioner: | - |
| Udvidet beskrivelse: | Reed Relay SPST-NC (1 Form B) 12VDC Coil Through Hole |
| Beskrivelse: | RELAY REED SPST-NC 3A 12V |
| Kontakt Rating (Aktuel): | 3A |
| Kontaktmateriale: | Rhodium (Rh) |
| Kontaktformular: | SPST-NC (1 Form B) |
| Spole spænding: | 12VDC |
| Spole type: | Non Latching |
| Coil Resistance: | 240 Ohms |
| Coil Power: | - |
| Coil Current: | 50mA |
| Email: | [email protected] |
Relaterede dele til DBR71210-HR
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
DBR71210F | Cynergy 3 | RELAY REED SPST-NC 3A 12V | Forespørgsel |
 |
DBR71210F-HR | Cynergy 3 | RELAY REED SPST-NC 3A 12V | Forespørgsel |
 |
DBR71210 | Cynergy 3 | RELAY REED SPST-NC 3A 12V | Forespørgsel |
 |
DBR71210S | Cynergy 3 | RELAY REED SPST-NC 3A 12V | Forespørgsel |
 |
DBR71210P | Cynergy 3 | RELAY REED SPST-NC 3A 12V | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers