Købe DS3151N+ med BYCHPS
Køb med garanti
DS3151N+
- Varenummer:
- DS3151N+
- Fabrikant:
- Maxim Integrated
- Beskrivelse:
- IC LIU DS3/E3/STS-1 144CSBGA
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15772 Pieces
- Datablad:
- DS3151N+.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for DS3151N+, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til DS3151N+ via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 3.135 V ~ 3.465 V |
|---|---|
| Leverandør Device Package: | 144-TECSBGA (13x13) |
| Serie: | - |
| Power (Watts): | - |
| Emballage: | Tray |
| Pakke / tilfælde: | 144-BGA, CSPBGA |
| Driftstemperatur: | -40°C ~ 85°C |
| Antal kredsløb: | 1 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Producentens varenummer: | DS3151N+ |
| grænseflade: | LIU |
| Inkluderer: | - |
| Fungere: | Line Interface Unit (LIU) |
| Udvidet beskrivelse: | Telecom IC Line Interface Unit (LIU) 144-TECSBGA (13x13) |
| Beskrivelse: | IC LIU DS3/E3/STS-1 144CSBGA |
| Nuværende - Forsyning: | 75mA |
| Email: | [email protected] |
Relaterede dele til DS3151N+
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers