Købe EP1M350F780C7ES med BYCHPS
Køb med garanti
EP1M350F780C7ES
- Varenummer:
- EP1M350F780C7ES
- Fabrikant:
- Altera (Intel)
- Beskrivelse:
- IC FPGA
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13051 Pieces
- Datablad:
- EP1M350F780C7ES.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for EP1M350F780C7ES, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til EP1M350F780C7ES via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 1.71 V ~ 1.89 V |
|---|---|
| Samlet RAM-bit: | 114688 |
| Leverandør Device Package: | 780-FBGA (29x29) |
| Serie: | Mercury |
| Pakke / tilfælde: | 780-BBGA, FCBGA |
| Driftstemperatur: | 0°C ~ 85°C (TJ) |
| Antal logiske elementer / celler: | 14400 |
| Antal LAB'er / CLB'er: | 1440 |
| Antal I / O: | 486 |
| Antal porte: | 350000 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Producentens varenummer: | EP1M350F780C7ES |
| Beskrivelse: | IC FPGA |
| Email: | [email protected] |
Relaterede dele til EP1M350F780C7ES
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
EP1M350F780C5 | Altera | IC FPGA 486 I/O 780FBGA | Forespørgsel |
|
EP1M350F780C7 | Altera | IC FPGA 486 I/O 780FBGA | Forespørgsel |
|
EP1M350F780C6 | Altera | IC FPGA 486 I/O 780FBGA | Forespørgsel |
 |
EP1M350F780I6AA | Altera | IC FPGA | Forespørgsel |
|
EP1M350F780I6 | Altera | IC FPGA 486 I/O 780FBGA | Forespørgsel |
|
EP1M350F780I6N | Altera | IC FPGA 486 I/O 780FBGA | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers