Købe EPC2007 med BYCHPS
Køb med garanti
EPC2007
- Varenummer:
- EPC2007
- Fabrikant:
- EPC
- Beskrivelse:
- TRANS GAN 100V 6A BUMPED DIE
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19940 Pieces
- Datablad:
- EPC2007.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for EPC2007, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til EPC2007 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Vgs (th) (Max) @ Id: | 2.5V @ 1.2mA |
|---|---|
| Teknologi: | GaNFET (Gallium Nitride) |
| Leverandør Device Package: | Die Outline (5-Solder Bar) |
| Serie: | eGaN® |
| Rds On (Max) @ Id, Vgs: | 30 mOhm @ 6A, 5V |
| Power Dissipation (Max): | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | Die |
| Andre navne: | 917-1015-2 |
| Driftstemperatur: | -40°C ~ 125°C (TJ) |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 14 Weeks |
| Producentens varenummer: | EPC2007 |
| Inputkapacitans (Ciss) (Max) @ Vds: | 205pF @ 50V |
| Gate Charge (Qg) (Max) @ Vgs: | 2.8nC @ 5V |
| FET Type: | N-Channel |
| FET-funktion: | - |
| Udvidet beskrivelse: | N-Channel 100V 6A (Ta) Surface Mount Die Outline (5-Solder Bar) |
| Afløb til Source Voltage (VDSS): | 100V |
| Beskrivelse: | TRANS GAN 100V 6A BUMPED DIE |
| Strøm - Kontinuerlig afløb (Id) @ 25 ° C: | 6A (Ta) |
| Email: | [email protected] |
Relaterede dele til EPC2007
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
EPC2007C | EPC | TRANS GAN 100V 6A BUMPED DIE | Forespørgsel |
 |
EPC2024ENG | EPC | TRANS GAN 40V 60A BUMPED DIE | Forespørgsel |
 |
EPC2030ENGR | EPC | TRANS GAN 40V 31A BUMPED DIE | Forespørgsel |
 |
EPC2018 | EPC | TRANS GAN 150V 12A BUMPED DIE | Forespørgsel |
 |
EPC2001 | EPC | TRANS GAN 100V 25A BUMPED DIE | Forespørgsel |
 |
EPC2025 | EPC | TRANS GAN 300V 150MO BUMPED DIE | Forespørgsel |
 |
EPC2037ENGR | EPC | TRANS GAN 100V BUMPED DIE | Forespørgsel |
|
EPC2001C | EPC | TRANS GAN 100V 36A BUMPED DIE | Forespørgsel |
 |
EPC2034 | EPC | TRANS GAN 200V 48A BUMPED DIE | Forespørgsel |
|
EPC2024ENGR | EPC | TRANS GAN 40V 60A BUMPED DIE | Forespørgsel |
 |
EPC2038 | EPC | TRANS GAN 100V 2.8OHM BUMPED DIE | Forespørgsel |
 |
EPC2035 | EPC | TRANS GAN 60V 1A BUMPED DIE | Forespørgsel |
|
EPC2038ENGR | EPC | TRANS GAN 100V 0.5A BUMPED DIE | Forespørgsel |
|
EPC2015CENGR | EPC | TRANS GAN 40V 36A BUMPED DIE | Forespørgsel |
|
EPC2030ENGRT | EPC | MOSFET NCH 40V 31A DIE | Forespørgsel |
|
EPC2033 | EPC | TRANS GAN 150V 7MOHM BUMPED DIE | Forespørgsel |
 |
EPC2020 | EPC | TRANS GAN 60V 90A BUMPED DIE | Forespørgsel |
 |
EPC2012CENGR | EPC | TRANS GAN 200V 5A BUMPED DIE | Forespørgsel |
|
EPC2031ENGRT | EPC | MOSFET NCH 60V 31A DIE | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers