Købe EPC2012CENGR med BYCHPS
Køb med garanti
EPC2012CENGR
- Varenummer:
- EPC2012CENGR
- Fabrikant:
- EPC
- Beskrivelse:
- TRANS GAN 200V 5A BUMPED DIE
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14093 Pieces
- Datablad:
- EPC2012CENGR.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for EPC2012CENGR, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til EPC2012CENGR via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Vgs (th) (Max) @ Id: | 2.5V @ 1mA |
|---|---|
| Teknologi: | GaNFET (Gallium Nitride) |
| Leverandør Device Package: | Die Outline (4-Solder Bar) |
| Serie: | eGaN® |
| Rds On (Max) @ Id, Vgs: | 100 mOhm @ 3A, 5V |
| Power Dissipation (Max): | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | Die |
| Andre navne: | 917-EPC2012CENGRTR |
| Driftstemperatur: | -40°C ~ 150°C (TJ) |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | EPC2012CENGR |
| Inputkapacitans (Ciss) (Max) @ Vds: | 100pF @ 100V |
| Gate Charge (Qg) (Max) @ Vgs: | 1nC @ 5V |
| FET Type: | N-Channel |
| FET-funktion: | - |
| Udvidet beskrivelse: | N-Channel 200V 5A (Ta) Surface Mount Die Outline (4-Solder Bar) |
| Afløb til Source Voltage (VDSS): | 200V |
| Beskrivelse: | TRANS GAN 200V 5A BUMPED DIE |
| Strøm - Kontinuerlig afløb (Id) @ 25 ° C: | 5A (Ta) |
| Email: | [email protected] |
Relaterede dele til EPC2012CENGR
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
EPC2014C | EPC | TRANS GAN 40V 10A BUMPED DIE | Forespørgsel |
 |
EPC2012 | EPC | TRANS GAN 200V 3A BUMPED DIE | Forespørgsel |
 |
EPC2018 | EPC | TRANS GAN 150V 12A BUMPED DIE | Forespørgsel |
 |
EPC2038ENGR | EPC | TRANS GAN 100V 0.5A BUMPED DIE | Forespørgsel |
 |
EPC2019ENG | EPC | TRANS GAN 200V 8.5A BUMPED DIE | Forespørgsel |
 |
EPC2010 | EPC | TRANS GAN 200V 12A BUMPED DIE | Forespørgsel |
|
EPC2010CENGR | EPC | TRANS GAN 200V 22A BUMPED DIE | Forespørgsel |
 |
EPC2016C | EPC | TRANS GAN 100V 18A BUMPED DIE | Forespørgsel |
 |
EPC2015C | EPC | TRANS GAN 40V 33A BUMPED DIE | Forespørgsel |
|
EPC2015CENGR | EPC | TRANS GAN 40V 36A BUMPED DIE | Forespørgsel |
|
EPC2010C | EPC | TRANS GAN 200V 22A BUMPED DIE | Forespørgsel |
|
EPC2012C | EPC | TRANS GAN 200V 5A BUMPED DIE | Forespørgsel |
|
EPC2015 | EPC | TRANS GAN 40V 33A BUMPED DIE | Forespørgsel |
|
EPC2014 | EPC | TRANS GAN 40V 10A BUMPED DIE | Forespørgsel |
 |
EPC2030ENGRT | EPC | MOSFET NCH 40V 31A DIE | Forespørgsel |
|
EPC2001C | EPC | TRANS GAN 100V 36A BUMPED DIE | Forespørgsel |
 |
EPC2016 | EPC | TRANS GAN 100V 11A BUMPED DIE | Forespørgsel |
 |
EPC2019 | EPC | TRANS GAN 200V 8.5A BUMPED DIE | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog