Købe ER1641-301JM med BYCHPS
Køb med garanti
ER1641-301JM
- Varenummer:
- ER1641-301JM
- Fabrikant:
- API Delevan
- Beskrivelse:
- FIXED IND 300NH 780MA 130 MOHM
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 18049 Pieces
- Datablad:
- ER1641-301JM.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for ER1641-301JM, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til ER1641-301JM via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Molded |
|---|---|
| Tolerance: | ±5% |
| Leverandør Device Package: | - |
| Størrelse / Dimension: | 0.162" Dia x 0.410" L (4.11mm x 10.41mm) |
| Afskærmning: | Shielded |
| Serie: | ER1641 |
| Vurderinger: | - |
| Q @ Freq: | 46 @ 25MHz |
| Emballage: | Bulk |
| Pakke / tilfælde: | Axial |
| Andre navne: | ER1641-301JM 2500 TR ER1641-301JM-MIL |
| Driftstemperatur: | -55°C ~ 105°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Materiale - Core: | Phenolic |
| Producentens varenummer: | ER1641-301JM |
| selvinduktion: | 300nH |
| Højde - Siddende (Max): | - |
| Frekvens - Test: | 25MHz |
| Frekvens - Selvresonans: | 250MHz |
| Udvidet beskrivelse: | 300nH Shielded Molded Inductor 780mA 130 mOhm Max Axial |
| Beskrivelse: | FIXED IND 300NH 780MA 130 MOHM |
| DC-resistens (DCR): | 130 mOhm Max |
| Nuværende vurdering: | 780mA |
| Nuværende - Mætning: | - |
| Email: | [email protected] |
Relaterede dele til ER1641-301JM
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog