Købe ES260XP med BYCHPS
Køb med garanti
ES260XP
- Varenummer:
- ES260XP
- Fabrikant:
- EPCOS
- Beskrivelse:
- GDT 220V 2.5KA THROUGH HOLE
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 18033 Pieces
- Datablad:
- ES260XP.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for ES260XP, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til ES260XP via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - DC Spark Over (Nom): | 220V |
|---|---|
| Tolerance: | - |
| Serie: | ES260XP |
| Emballage: | Bulk |
| Pakke / tilfælde: | Axial Cylinder, Radial Bend |
| Andre navne: | 495-4279 B88069X5920B502 |
| Antal polakker: | 2 |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 16 Weeks |
| Producentens varenummer: | ES260XP |
| Impulsudladningstrøm (8 / 20μs): | 2500A (2.5kA) |
| Fejl kort: | No |
| Udvidet beskrivelse: | Gas Discharge Tube 2500A (2.5kA) 2 Pole Through Hole |
| Beskrivelse: | GDT 220V 2.5KA THROUGH HOLE |
| Email: | [email protected] |
Relaterede dele til ES260XP
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
SL1003A250SMF | Littelfuse Inc. | GDT 250V 10KA SMD FAIL SHORT | Forespørgsel |
 |
2026-07-C4LF | Bourns Inc. | GDT 75V 20% 20KA THROUGH HOLE | Forespørgsel |
 |
2036-42-B2F | Bourns Inc. | GDT 420V 20% 10KA T/H FAIL SHORT | Forespørgsel |
 |
SL1024B500R | Littelfuse Inc. | GDT 500V 20KA THROUGH HOLE | Forespørgsel |
 |
B88069X8360C203 | EPCOS (TDK) | GDT 90V 20% 10KA | Forespørgsel |
 |
2046-23-ALF | Bourns Inc. | GDT 230V 20% 10KA | Forespørgsel |
 |
GTCA28-141M-R10 | Littelfuse Inc. | GDT 140V 20% 10KA THROUGH HOLE | Forespørgsel |
 |
2061-23-ALF | Bourns Inc. | GDT 230V 20% 40KA | Forespørgsel |
|
B88069X790T502 | EPCOS (TDK) | EC 600XG | Forespørgsel |
|
SL1021B200RG | Littelfuse Inc. | GDT 200V 20KA T/H FAIL SHORT | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog