Købe F1778368M3F0W0 med BYCHPS
Køb med garanti
F1778368M3F0W0
- Varenummer:
- F1778368M3F0W0
- Fabrikant:
- Angstrohm / Vishay
- Beskrivelse:
- CAP FILM 0.068UF 20% 630VDC RAD
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13136 Pieces
- Datablad:
- F1778368M3F0W0.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for F1778368M3F0W0, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til F1778368M3F0W0 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering - DC: | 630V |
|---|---|
| Spændingsbedømmelse - AC: | 310V |
| Tolerance: | ±20% |
| Afslutning: | PC Pins |
| Størrelse / Dimension: | 0.689" L x 0.197" W (17.50mm x 5.00mm) |
| Serie: | F1778X2 |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | Radial |
| Andre navne: | 1778368M3F0W0 |
| Driftstemperatur: | -55°C ~ 110°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 17 Weeks |
| Producentens varenummer: | F1778368M3F0W0 |
| Blyafstand: | 0.591" (15.00mm) |
| Højde - Siddende (Max): | 0.433" (11.00mm) |
| Funktioner: | X2 Safety Rated |
| Udvidet beskrivelse: | 0.068µF ±20% Film Capacitor 310V 630V Polypropylene (PP), Metallized Radial |
| ESR (Equivalent Series Resistance): | - |
| Dielektrisk materiale: | Polypropylene (PP), Metallized |
| Beskrivelse: | CAP FILM 0.068UF 20% 630VDC RAD |
| kapacitans: | 0.068µF |
| Applikationer: | EMI, RFI Suppression |
| Email: | [email protected] |
Relaterede dele til F1778368M3F0W0
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers