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F55J2K0E
- Varenummer:
- F55J2K0E
- Fabrikant:
- Ohmite
- Beskrivelse:
- RES CHAS MNT 2K OHM 5% 55W
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12983 Pieces
- Datablad:
- F55J2K0E.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for F55J2K0E, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til F55J2K0E via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Tolerance: | ±5% |
|---|---|
| Temperaturkoefficient: | ±260ppm/°C |
| Størrelse / Dimension: | 3.500" L x 1.000" W (88.90mm x 25.40mm) |
| Serie: | Stackohm® 250 |
| Modstand (ohm): | 2k |
| Power (Watts): | 55W |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Flat Oval |
| Andre navne: | OHF55J2K0E OHF55J2K0E-ND |
| Driftstemperatur: | -55°C ~ 350°C |
| Monteringsfunktion: | Flange Braces, Right Angle |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 10 Weeks |
| Producentens varenummer: | F55J2K0E |
| Lead Style: | Solder Lugs |
| Højde - Siddende (Max): | 0.563" (14.29mm) |
| Funktioner: | - |
| Fejlrate: | - |
| Beskrivelse: | RES CHAS MNT 2K OHM 5% 55W |
| Sammensætning: | Wirewound |
| Belægning, Boligtype: | Vitreous Enamel Coated |
| Email: | [email protected] |
Relaterede dele til F55J2K0E
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810F5R0E | Ohmite | RES CHAS MNT 5 OHM 1% 10W | Forespørgsel |
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F55J25RE | Ohmite | RES CHAS MNT 25 OHM 5% 55W | Forespørgsel |
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F55J200E | Ohmite | RES CHAS MNT 200 OHM 5% 55W | Forespørgsel |
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F55J20K | Ohmite | RES CHAS MNT 20K OHM 5% 55W | Forespørgsel |
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F55J2R0E | Ohmite | RES CHAS MNT 2 OHM 5% 55W | Forespørgsel |
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F55J2K5 | Ohmite | RES CHAS MNT 2.5K OHM 5% 55W | Forespørgsel |
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F55J25R | Ohmite | RES CHAS MNT 25 OHM 5% 55W | Forespørgsel |
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F55J2K0 | Ohmite | RES CHAS MNT 2K OHM 5% 55W | Forespørgsel |
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F55J200 | Ohmite | RES CHAS MNT 200 OHM 5% 55W | Forespørgsel |
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Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
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- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers