Købe FB73-287 med BYCHPS
Køb med garanti
FB73-287
- Varenummer:
- FB73-287
- Fabrikant:
- Bourns, Inc.
- Beskrivelse:
- FERRITE CORE SOLID 2.64MM
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 12722 Pieces
- Datablad:
- FB73-287.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for FB73-287, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til FB73-287 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Round |
|---|---|
| Serie: | FB |
| Vurderinger: | - |
| Ydermål: | 0.311" Dia (7.89mm) |
| Andre navne: | M2310 |
| Monteringstype: | Free Hanging |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Materiale: | 73 |
| Producentens varenummer: | FB73-287 |
| Længde: | 0.312" (7.92mm) |
| Indvendig Dimension: | 0.104" Dia (2.64mm) |
| Impedans @ Frekvens: | - |
| Udvidet beskrivelse: | Solid Free Hanging Ferrite Core ID 0.104" Dia (2.64mm) OD 0.311" Dia (7.89mm) Length 0.312" (7.92mm) |
| Design: | Solid |
| Beskrivelse: | FERRITE CORE SOLID 2.64MM |
| Email: | [email protected] |
Relaterede dele til FB73-287
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
FB73-422-RC | Bourns Inc. | FERRITE CORE SOLID 1.77MM | Forespørgsel |
 |
FB73-287-RC | Bourns Inc. | FERRITE CORE SOLID 2.64MM | Forespørgsel |
|
FB73-422 | Bourns Inc. | FERRITE CORE SOLID 1.77MM | Forespørgsel |
 |
FB73-226-RC | Bourns Inc. | FERRITE CORE SOLID 1.52MM | Forespørgsel |
|
FB73-226 | Bourns Inc. | FERRITE CORE SOLID 1.52MM | Forespørgsel |
 |
ZCAT2017-0930B-M | TDK Corporation | FERRITE CORE 50 OHM HINGED 9MM | Forespørgsel |
 |
FB73-110 | Bourns Inc. | FERRITE CORE SOLID 1.52MM | Forespørgsel |
|
FB73-110-RC | Bourns Inc. | FERRITE CORE SOLID 1.52MM | Forespørgsel |
 |
FB73-085 | Bourns Inc. | FERRITE CORE SOLID 0.78MM | Forespørgsel |
|
FB73-085-RC | Bourns Inc. | FERRITE CORE SOLID 0.78MM | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog