Købe GS1660AIBE3 med BYCHPS
Køb med garanti
GS1660AIBE3
- Varenummer:
- GS1660AIBE3
- Fabrikant:
- Semtech
- Beskrivelse:
- IC RECEIVER SMPTE 100BGA
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12415 Pieces
- Datablad:
- GS1660AIBE3.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for GS1660AIBE3, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til GS1660AIBE3 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Receiver |
|---|---|
| Leverandør Device Package: | 100-LBGA (11x11) |
| Serie: | - |
| Emballage: | Tray |
| Pakke / tilfælde: | 100-LBGA |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Fabrikantens standard ledetid: | 8 Weeks |
| Producentens varenummer: | GS1660AIBE3 |
| Beskrivelse: | IC RECEIVER SMPTE 100BGA |
| Applikationer: | Video |
| Email: | [email protected] |
Relaterede dele til GS1660AIBE3
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
GS1660-IBE3 | Semtech Corporation | IC SDI RECEIVER SMPTE 100BGA | Forespørgsel |
|
GS1661AIBE3 | Semtech Corporation | IC RECEIVER CBL EQUALIZER 100BGA | Forespørgsel |
|
GS1662-IBE3 | Semtech Corporation | IC SERIALIZER SMPTE 100BGA | Forespørgsel |
 |
NJM2240D# | NJR Corporation/NJRC | IC VIDEO SIGNAL QUADRUPLER 8-DIP | Forespørgsel |
 |
AD8322ARUZ-REEL | Analog Devices Inc. | IC LN DVR CATV COARS-STP 28TSSOP | Forespørgsel |
|
GS1661-IBE3 | Semtech Corporation | IC RECEIVER CBL EQUALIZER 100BGA | Forespørgsel |
 |
ADV7180WBCP32Z-RL | Analog Devices Inc. | IC VIDEO DECODER SDTV 32LFCSP | Forespørgsel |
 |
MAX14886CTL+ | Maxim Integrated | MUX DUAL HDMI LVL SHIFTER 40TQFN | Forespørgsel |
 |
MAX4929EEEP+ | Maxim Integrated | IC SWITCH HDMI 2:1 20-QSOP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers