Købe JTDB75 med BYCHPS
Køb med garanti
JTDB75
- Varenummer:
- JTDB75
- Fabrikant:
- Microsemi
- Beskrivelse:
- TRANS RF BIPO 220W 8A 55AW1
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13323 Pieces
- Datablad:
- JTDB75.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for JTDB75, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til JTDB75 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 55V |
|---|---|
| Transistor Type: | NPN |
| Leverandør Device Package: | 55AW |
| Serie: | - |
| Strøm - Max: | 220W |
| Emballage: | Bulk |
| Pakke / tilfælde: | 55AW |
| Driftstemperatur: | 200°C (TJ) |
| Støjbillede (dB Typ @ f): | - |
| Monteringstype: | Chassis Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | JTDB75 |
| Gevinst: | 7dB ~ 8.2dB |
| Frekvens - Overgang: | 960MHz ~ 1.215GHz |
| Udvidet beskrivelse: | RF Transistor NPN 55V 8A 960MHz ~ 1.215GHz 220W Chassis Mount 55AW |
| Beskrivelse: | TRANS RF BIPO 220W 8A 55AW1 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 20 @ 1A, 5V |
| Nuværende - Samler (Ic) (Max): | 8A |
| Email: | [email protected] |
Relaterede dele til JTDB75
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
NE68139R-T1 | CEL | TRANS NPN 1GHZ SOT-143R | Forespørgsel |
 |
2N5179 | Microsemi Corporation | TRANS RF NPN 12V 50MA TO72 | Forespørgsel |
 |
HFA3102BZ | Intersil | IC TRANS ARRAY DUAL NPN 14-SOIC | Forespørgsel |
 |
BFP405H6327XTSA1 | Infineon Technologies | TRANS RF NPN 4.5V 25MA SOT343 | Forespørgsel |
 |
AT-41486-TR1G | Broadcom Limited | TRANS NPN BIPO 12V 60MA 86-SMD | Forespørgsel |
|
MS2341 | Microsemi Corporation | TRANS RF BIPO 87.5W 2.6A M115 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers