Købe LCB126 med BYCHPS
Køb med garanti
LCB126
- Varenummer:
- LCB126
- Fabrikant:
- IXYS Integrated Circuits Division
- Beskrivelse:
- RELAY OPTOMOS 170MA SP-NC 6-DIP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12844 Pieces
- Datablad:
- LCB126.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for LCB126, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til LCB126 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Belastning: | 0 ~ 250 V |
|---|---|
| Spænding - Indgang: | 1.2VDC |
| Afslutningsstil: | PC Pin |
| Leverandør Device Package: | 6-DIP |
| Serie: | LCB, OptoMOS® |
| Relæ Type: | Relay |
| Emballage: | Tube |
| Pakke / tilfælde: | 6-DIP (0.300", 7.62mm) |
| Output Type: | AC, DC |
| On-State Resistance (Max): | 15 Ohm |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 5 Weeks |
| Producentens varenummer: | LCB126 |
| Load Current: | 170mA |
| Udvidet beskrivelse: | Solid State Relay SPST-NC (1 Form B) 6-DIP (0.300", 7.62mm) |
| Beskrivelse: | RELAY OPTOMOS 170MA SP-NC 6-DIP |
| Kredsløb: | SPST-NC (1 Form B) |
| Email: | [email protected] |
Relaterede dele til LCB126
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers