Købe LM1815N med BYCHPS
Køb med garanti
LM1815N
- Varenummer:
- LM1815N
- Fabrikant:
- Beskrivelse:
- IC AMP ADAPTIVE SENSOR 14-DIP
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 12342 Pieces
- Datablad:
- LM1815N.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for LM1815N, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til LM1815N via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Sensor Interface |
|---|---|
| Leverandør Device Package: | 14-DIP |
| Serie: | - |
| Emballage: | Tube |
| Pakke / tilfælde: | 14-DIP (0.300", 7.62mm) |
| Output Type: | Logic |
| Driftstemperatur: | -40°C ~ 125°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | LM1815N |
| grænseflade: | - |
| Input Type: | Logic |
| Beskrivelse: | IC AMP ADAPTIVE SENSOR 14-DIP |
| Nuværende - Forsyning: | 6mA |
| Email: | [email protected] |
Relaterede dele til LM1815N
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
|
LM1815MX/NOPB | Texas Instruments | IC AMP ADAPTIV VAR SENSOR 14SOIC | Forespørgsel |
|
LM1815M | Texas Instruments | IC ADAPTIVE SENSE AMP 14SOIC | Forespørgsel |
|
LM1815MX | Texas Instruments | IC AMP ADAPTIV VAR SENSOR 14SOIC | Forespørgsel |
|
LM1815M/NOPB | Texas Instruments | IC ADAPTIVE SENSE AMP 14SOIC | Forespørgsel |
 |
BD9261EFV-E2 | Rohm Semiconductor | IC PREAMP HBD PIR SENSOR 14SSOP | Forespørgsel |
 |
MAX6603ATB+T | Maxim Integrated | IC COND RTD-VOLT 10-TDFN | Forespørgsel |
|
LM1815N/NOPB | Texas Instruments | IC AMP ADAPTIVE SENSOR 14-DIP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers