Købe MAL215752331E3 med BYCHPS
Køb med garanti
MAL215752331E3
- Varenummer:
- MAL215752331E3
- Fabrikant:
- Angstrohm / Vishay
- Beskrivelse:
- CAP ALUM 330UF 20% 200V SNAP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12404 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for MAL215752331E3, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til MAL215752331E3 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsbedømmelse: | 200V |
|---|---|
| Tolerance: | ±20% |
| Overflade Mount Land Størrelse: | - |
| Størrelse / Dimension: | 0.866" Dia (22.00mm) |
| Serie: | 157 PUM-SI |
| Ripple Current: | 1.36A @ 120Hz |
| Polarisering: | Polar |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Can - Snap-In |
| Driftstemperatur: | -25°C ~ 85°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 11 Weeks |
| Producentens varenummer: | MAL215752331E3 |
| Levetid @ Temp.: | 5000 Hrs @ 85°C |
| Blyafstand: | 0.394" (10.00mm) |
| Impedans: | 500 mOhm |
| Højde - Siddende (Max): | 1.260" (32.00mm) |
| Udvidet beskrivelse: | 330µF 200V Aluminum Capacitors Radial, Can - Snap-In 820 mOhm @ 100Hz 5000 Hrs @ 85°C |
| ESR (Equivalent Series Resistance): | 820 mOhm @ 100Hz |
| Beskrivelse: | CAP ALUM 330UF 20% 200V SNAP |
| kapacitans: | 330µF |
| Applikationer: | General Purpose |
| Email: | [email protected] |
Relaterede dele til MAL215752331E3
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog