Købe MCP607-I/ST med BYCHPS
Køb med garanti
MCP607-I/ST
- Varenummer:
- MCP607-I/ST
- Fabrikant:
- Micrel / Microchip Technology
- Beskrivelse:
- IC OPAMP GP 155KHZ RRO 8TSSOP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19134 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for MCP607-I/ST, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til MCP607-I/ST via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Tilførsel, Single / Dual (±): | 2.5 V ~ 6 V |
|---|---|
| Spænding - Indgangsforskydning: | 250µV |
| Leverandør Device Package: | 8-TSSOP |
| Slew Rate: | 0.08 V/µs |
| Serie: | - |
| Emballage: | Tube |
| Pakke / tilfælde: | 8-TSSOP (0.173", 4.40mm Width) |
| Output Type: | Rail-to-Rail |
| Andre navne: | MCP607IST |
| Driftstemperatur: | -40°C ~ 85°C |
| Antal kredsløb: | 2 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 6 Weeks |
| Producentens varenummer: | MCP607-I/ST |
| Få båndbreddeprodukt: | 155kHz |
| Udvidet beskrivelse: | General Purpose Amplifier 2 Circuit Rail-to-Rail 8-TSSOP |
| Beskrivelse: | IC OPAMP GP 155KHZ RRO 8TSSOP |
| Nuværende - Forsyning: | 18.7µA |
| Nuværende - Output / Channel: | 17mA |
| Nuværende - Input Bias: | 1pA |
| Forstærker Type: | General Purpose |
| -3db båndbredde: | - |
| Email: | [email protected] |
Relaterede dele til MCP607-I/ST
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog