Købe MDS500L med BYCHPS
Køb med garanti
MDS500L
- Varenummer:
- MDS500L
- Fabrikant:
- Microsemi
- Beskrivelse:
- TRANS RF BIPO 833W 24A 55ST1
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13016 Pieces
- Datablad:
- MDS500L.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for MDS500L, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til MDS500L via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 70V |
|---|---|
| Transistor Type: | NPN |
| Leverandør Device Package: | 55ST |
| Serie: | - |
| Strøm - Max: | 833W |
| Emballage: | Bulk |
| Pakke / tilfælde: | 55ST |
| Driftstemperatur: | 200°C (TJ) |
| Støjbillede (dB Typ @ f): | - |
| Monteringstype: | Chassis Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | MDS500L |
| Gevinst: | 9.2dB |
| Frekvens - Overgang: | 1.03GHz ~ 1.09GHz |
| Udvidet beskrivelse: | RF Transistor NPN 70V 24A 1.03GHz ~ 1.09GHz 833W Chassis Mount 55ST |
| Beskrivelse: | TRANS RF BIPO 833W 24A 55ST1 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 20 @ 1A, 5V |
| Nuværende - Samler (Ic) (Max): | 24A |
| Email: | [email protected] |
Relaterede dele til MDS500L
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
2SC5007-A | CEL | RF TRANSISTOR NPN SOT-523 | Forespørgsel |
 |
CPH6020-TL-E | ON Semiconductor | TRANS NPN 8V 0.15A CPH6 | Forespørgsel |
 |
AT-42010 | Broadcom Limited | TRANS NPN BIPO 12V 80MA 100-SMD | Forespørgsel |
 |
SD1274 | STMicroelectronics | TRANS NPN RF MICROWAVE VHF M135 | Forespørgsel |
 |
BFU725F,115 | NXP USA Inc. | TRANS NPN 20GHZ SOT343F | Forespørgsel |
 |
10502 | Microsemi Corporation | TRANS BIPO 50V 500W 55SM | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers