Købe NT24L55-GRP8 med BYCHPS
Køb med garanti
NT24L55-GRP8
- Varenummer:
- NT24L55-GRP8
- Fabrikant:
- Semtech
- Beskrivelse:
- IC AMP TIA AGC 1.25 EPON DIE
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12225 Pieces
- Datablad:
- NT24L55-GRP8.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for NT24L55-GRP8, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til NT24L55-GRP8 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Transimpedance Amplifier |
|---|---|
| Leverandør Device Package: | Die |
| Serie: | - |
| Emballage: | Tray |
| Pakke / tilfælde: | Die |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | NT24L55-GRP8 |
| Udvidet beskrivelse: | Transimpedance Amplifier IC Die |
| Beskrivelse: | IC AMP TIA AGC 1.25 EPON DIE |
| Applikationer: | - |
| Email: | [email protected] |
Relaterede dele til NT24L55-GRP8
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
NT24L55-GRP6 | Semtech Corporation | IC AMP TIA AGC 1.25 EPON DIE | Forespørgsel |
|
NT24L55-DTF8S | Semtech Corporation | IC AMP TIA AGC 1.25 EPON DIE | Forespørgsel |
|
NT24L55-PR | Semtech Corporation | IC AMP TIA AGC 1.25 EPON DIE | Forespørgsel |
|
NT24L50-WP | Semtech Corporation | IC AMP TIA AGC 1.25G GBE/EPON | Forespørgsel |
|
NT24L55-WP | Semtech Corporation | IC AMP TIA AGC 1.25 EPON DIE | Forespørgsel |
|
NT24L71-QSOP | Semtech Corporation | IC AMP LIMITING 1.25GBPS 16QSOP | Forespørgsel |
|
NT24L50-GRP8 | Semtech Corporation | IC AMP TIA AGC 1.25G GBE/EPON | Forespørgsel |
|
NT24L50-GRP6 | Semtech Corporation | IC AMP TIA AGC 1.25G GBE/EPON | Forespørgsel |
 |
NT24L73-MSOP-TR | Semtech Corporation | IC AMP LIMITING 1.25GBPS 10MSOP | Forespørgsel |
|
NT24L71-QSOP-TR | Semtech Corporation | IC AMP LIMITING 1.25GBPS 16QSOP | Forespørgsel |
|
NT24L50-PR | Semtech Corporation | IC AMP TIA AGC 1.25G GBE/EPON | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog