Købe NT25L55-DTF8SR med BYCHPS
Køb med garanti
NT25L55-DTF8SR
- Varenummer:
- NT25L55-DTF8SR
- Fabrikant:
- Semtech
- Beskrivelse:
- IC AMP TIA BARE DIE
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19597 Pieces
- Datablad:
- NT25L55-DTF8SR.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for NT25L55-DTF8SR, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til NT25L55-DTF8SR via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Serie: | * |
|---|---|
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | NT25L55-DTF8SR |
| Udvidet beskrivelse: | IC |
| Beskrivelse: | IC AMP TIA BARE DIE |
| Email: | [email protected] |
Relaterede dele til NT25L55-DTF8SR
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
NT25L59-WP | Semtech Corporation | IC AMP TIA 2.5G AGC GPON PD DIE | Forespørgsel |
|
NT25L59-GRP6 | Semtech Corporation | IC AMP TIA 2.5G AGC GPON PD DIE | Forespørgsel |
|
NT25L59-GRP8 | Semtech Corporation | IC AMP TIA 2.5G AGC GPON PD DIE | Forespørgsel |
|
NT25L91-QFN | Semtech Corporation | IC TXRX LDD&LA 2.5GBPS 28QFN | Forespørgsel |
|
NT25L59-DTF8S | Semtech Corporation | IC AMP TIA 2.5G AGC GPON PD DIE | Forespørgsel |
|
NT25L51-WP | Semtech Corporation | IC AMP TIA AGC OC48/GPONG DIE | Forespørgsel |
|
NT25L59-PR | Semtech Corporation | IC AMP TIA 2.5G AGC GPON PD DIE | Forespørgsel |
|
NT25L51-GRP6 | Semtech Corporation | IC AMP TIA AGC OC48/GPONG DIE | Forespørgsel |
|
NT25L51-GRP8 | Semtech Corporation | IC AMP TIA AGC OC48/GPONG DIE | Forespørgsel |
|
NT25L51-PR | Semtech Corporation | IC AMP TIA AGC OC48/GPONG DIE | Forespørgsel |
|
NT25L55-PR | Semtech Corporation | IC AMP TIA BARE DIE | Forespørgsel |
|
NT25L91-QFN-TR | Semtech Corporation | IC TXRX LDD&LA 2.5GBPS 28QFN | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers