Købe PC10HT-270 med BYCHPS
Køb med garanti
PC10HT-270
- Varenummer:
- PC10HT-270
- Fabrikant:
- Maxwell Technologies, Inc.
- Beskrivelse:
- CAP 10F 2.2V THROUGH HOLE
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17427 Pieces
- Datablad:
- PC10HT-270.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for PC10HT-270, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til PC10HT-270 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 2.2V |
|---|---|
| Tolerance: | - |
| Afslutning: | Through Hole |
| Størrelse / Dimension: | 1.413" L x 0.929" W (35.90mm x 23.60mm) |
| Serie: | PC |
| Emballage: | Tray |
| Pakke / tilfælde: | Radial, Can, Horizontal |
| Andre navne: | 108877 1182-1005 PC10HT270 |
| Driftstemperatur: | -40°C ~ 85°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | PC10HT-270 |
| Levetid @ Temp.: | 1000 Hrs @ 85°C |
| Blyafstand: | 0.201" (5.10mm) |
| Højde - Siddende (Max): | 0.197" (5.00mm) |
| Udvidet beskrivelse: | 10F (EDLC) Supercapacitor 2.2V Radial, Can, Horizontal 180 mOhm 1000 Hrs @ 85°C |
| ESR (Equivalent Series Resistance): | 180 mOhm |
| Beskrivelse: | CAP 10F 2.2V THROUGH HOLE |
| kapacitans: | 10F |
| Email: | [email protected] |
Relaterede dele til PC10HT-270
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
EDLRD224V3R6C | Cornell Dubilier Electronics (CDE) | CAP 220MF -20% +80% 3.6V T/H | Forespørgsel |
 |
PC10HT-90 | Maxwell Technologies Inc. | CAP 10F 2.2V THROUGH HOLE | Forespørgsel |
 |
PC10HT | Maxwell Technologies Inc. | CAP 10F 2.2V THROUGH HOLE | Forespørgsel |
 |
JJL0E158MSEF | Nichicon | CAP 1500F 20% 2.5V CHASSIS MOUNT | Forespørgsel |
 |
KW-5R5C684-R | Eaton | CAP 680MF -20% +80% 5.5V T/H | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog