Købe PI3VDP411LSAZBEX med BYCHPS
Køb med garanti
PI3VDP411LSAZBEX
- Varenummer:
- PI3VDP411LSAZBEX
- Fabrikant:
- Diodes Incorporated
- Beskrivelse:
- IC DEMULTIPLEXER 48TQFN
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14547 Pieces
- Datablad:
- PI3VDP411LSAZBEX.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for PI3VDP411LSAZBEX, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til PI3VDP411LSAZBEX via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 3 V ~ 3.6 V |
|---|---|
| Leverandør Device Package: | 48-TQFN (7x7) |
| Serie: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 48-VFQFN Exposed Pad |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 8 Weeks |
| Producentens varenummer: | PI3VDP411LSAZBEX |
| grænseflade: | - |
| Udvidet beskrivelse: | DVI, HDMI Level Switching Interface 48-TQFN (7x7) |
| Beskrivelse: | IC DEMULTIPLEXER 48TQFN |
| Applikationer: | DVI, HDMI Level Switching |
| Email: | [email protected] |
Relaterede dele til PI3VDP411LSAZBEX
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
PI3VDP411LSTZBEX | Diodes Incorporated | IC DEMULTIPLEXER 48TQFN | Forespørgsel |
|
PI3VDP411LSZBE | Diodes Incorporated | IC DEMULTIPLEXER 48TQFN | Forespørgsel |
|
PI3VDP411LSAZBE | Diodes Incorporated | IC DEMULTIPLEXER 48TQFN | Forespørgsel |
|
PI3VDP411LSZBEX | Diodes Incorporated | IC DEMULTIPLEXER 48TQFN | Forespørgsel |
|
PI3VDP411LSTZBE | Diodes Incorporated | IC DEMULTIPLEXER 48TQFN | Forespørgsel |
|
PI3VDP411LSRZBEX | Diodes Incorporated | IC DEMULTIPLEXER 48TQFN | Forespørgsel |
|
PI3VDP411LSRZBE | Diodes Incorporated | IC DEMULTIPLEXER 48TQFN | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers