Købe PS21267-AP med BYCHPS
Køb med garanti
PS21267-AP
- Varenummer:
- PS21267-AP
- Fabrikant:
- Powerex, Inc.
- Beskrivelse:
- MOD IPM 600V 30A DIP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19466 Pieces
- Datablad:
- PS21267-AP.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for PS21267-AP, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til PS21267-AP via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Isolering: | 2500VDC |
|---|---|
| Spænding: | 600V |
| Type: | IGBT |
| Serie: | Intellimod™ |
| Pakke / tilfælde: | 26-PowerDIP Module (1.370", 34.80mm) |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 20 Weeks |
| Producentens varenummer: | PS21267-AP |
| Udvidet beskrivelse: | Power Driver Module IGBT 3 Phase 600V 30A 26-PowerDIP Module (1.370", 34.80mm) |
| Beskrivelse: | MOD IPM 600V 30A DIP |
| Nuværende: | 30A |
| Konfiguration: | 3 Phase |
| Email: | [email protected] |
Relaterede dele til PS21267-AP
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
M63994P | Powerex Inc. | HVIC HALF-BRIDGE DVR 8SOP | Forespørgsel |
|
PS21265-AP | Powerex Inc. | MOD IPM 600V 20A DIP | Forespørgsel |
|
PS21254-EP | Powerex Inc. | MOD IPM 600V 15A DIP | Forespørgsel |
 |
FSB50760SFS | Fairchild/ON Semiconductor | MODULE SPM 600V 2A SPM5P-023 | Forespørgsel |
 |
IGCM06G60GAXKMA1 | Infineon Technologies | IGBT 600V 24MDIP | Forespørgsel |
 |
FPDB50PH60 | Fairchild/ON Semiconductor | MODULE SPM 600V 30A SPMHA | Forespørgsel |
|
PS21245-EP | Powerex Inc. | MOD IPM 600V 20A DIP | Forespørgsel |
|
PS21255-EP | Powerex Inc. | MOD IPM 600V 20A DIP | Forespørgsel |
|
PS21244-EP | Powerex Inc. | MOD IPM 600V 15A DIP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers