Købe PS21563-P med BYCHPS
Køb med garanti
PS21563-P
- Varenummer:
- PS21563-P
- Fabrikant:
- Powerex, Inc.
- Beskrivelse:
- MOD IPM 600V 10A MINI DIP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16986 Pieces
- Datablad:
- PS21563-P.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for PS21563-P, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til PS21563-P via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Isolering: | 2500VDC |
|---|---|
| Spænding: | 600V |
| Type: | IGBT |
| Serie: | Intellimod™ |
| Pakke / tilfælde: | 35-PowerDIP Module (1.370", 34.80mm) |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | PS21563-P |
| Udvidet beskrivelse: | Power Driver Module IGBT 3 Phase 600V 10A 35-PowerDIP Module (1.370", 34.80mm) |
| Beskrivelse: | MOD IPM 600V 10A MINI DIP |
| Nuværende: | 10A |
| Konfiguration: | 3 Phase |
| Email: | [email protected] |
Relaterede dele til PS21563-P
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
PS21564-P | Powerex Inc. | MOD IPM 600V 15A MINI DIP | Forespørgsel |
|
PS21564-SP | Powerex Inc. | MOD IPM 600V 15A MINI DIP | Forespørgsel |
|
PS21563-SP | Powerex Inc. | MOD IPM 600V 10A MINI DIP | Forespørgsel |
|
PS21562-P | Powerex Inc. | MOD IPM 600V 5A MINI DIP | Forespørgsel |
|
PS21562-SP | Powerex Inc. | MOD IPM 600V 5A MINI DIP | Forespørgsel |
|
PM800HSA120 | Powerex Inc. | MOD IPM SINGLE HF 1200V 800A | Forespørgsel |
|
PM300RL1A060 | Powerex Inc. | MOD IPM 7-PAC L1 300A 600V | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers