Købe SCT3040KLGC11 med BYCHPS
Køb med garanti
SCT3040KLGC11
- Varenummer:
- SCT3040KLGC11
- Fabrikant:
- LAPIS Semiconductor
- Beskrivelse:
- MOSFET NCH 1.2KV 55A TO247N
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 20398 Pieces
- Datablad:
- SCT3040KLGC11.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for SCT3040KLGC11, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til SCT3040KLGC11 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Vgs (th) (Max) @ Id: | 5.6V @ 10mA |
|---|---|
| Vgs (Max): | +22V, -4V |
| Teknologi: | SiCFET (Silicon Carbide) |
| Leverandør Device Package: | TO-247N |
| Serie: | - |
| Rds On (Max) @ Id, Vgs: | 52 mOhm @ 20A, 18V |
| Power Dissipation (Max): | 262W (Tc) |
| Emballage: | Tube |
| Pakke / tilfælde: | TO-247-3 |
| Driftstemperatur: | 175°C (TJ) |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 18 Weeks |
| Producentens varenummer: | SCT3040KLGC11 |
| Inputkapacitans (Ciss) (Max) @ Vds: | 1337pF @ 800V |
| Gate Charge (Qg) (Max) @ Vgs: | 107nC @ 18V |
| FET Type: | N-Channel |
| FET-funktion: | - |
| Udvidet beskrivelse: | N-Channel 1200V (1.2kV) 55A (Tc) 262W (Tc) Through Hole TO-247N |
| Drevspænding (Maks. Rds On, Min Rds On): | 18V |
| Afløb til Source Voltage (VDSS): | 1200V (1.2kV) |
| Beskrivelse: | MOSFET NCH 1.2KV 55A TO247N |
| Strøm - Kontinuerlig afløb (Id) @ 25 ° C: | 55A (Tc) |
| Email: | [email protected] |
Relaterede dele til SCT3040KLGC11
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers