Købe SD1446 med BYCHPS
Køb med garanti
SD1446
- Varenummer:
- SD1446
- Fabrikant:
- ST
- Beskrivelse:
- TRANSISTOR NPN RF BIPO UHF M113
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19346 Pieces
- Datablad:
- SD1446.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for SD1446, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til SD1446 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 18V |
|---|---|
| Transistor Type: | NPN |
| Leverandør Device Package: | M113 |
| Serie: | - |
| Strøm - Max: | 183W |
| Emballage: | Bulk |
| Pakke / tilfælde: | M113 |
| Andre navne: | 497-5458 SD1446-ND |
| Driftstemperatur: | 200°C (TJ) |
| Støjbillede (dB Typ @ f): | - |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | SD1446 |
| Gevinst: | 10dB |
| Frekvens - Overgang: | - |
| Udvidet beskrivelse: | RF Transistor NPN 18V 12A 183W Surface Mount M113 |
| Beskrivelse: | TRANSISTOR NPN RF BIPO UHF M113 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 10 @ 5A, 5V |
| Nuværende - Samler (Ic) (Max): | 12A |
| Email: | [email protected] |
Relaterede dele til SD1446
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
BFU530AR | NXP USA Inc. | TRANS RF NPN 12V 40MA TO-236AB | Forespørgsel |
 |
MZ0912B100Y,114 | Ampleon USA Inc. | TRANSISTOR POWER NPN SOT443A | Forespørgsel |
|
BFS17A,235 | NXP USA Inc. | TRANS NPN 15V 25MA 3GHZ SOT23 | Forespørgsel |
 |
BFP405E6740HTSA1 | Infineon Technologies | TRANSISTOR NPN RF 4.5V SOT-343 | Forespørgsel |
 |
NE664M04-A | CEL | RF TRANSISTOR NPN SOT-343F | Forespørgsel |
 |
2SC4536-T1-AZ | CEL | RF TRANSISTOR NPN SOT-89 | Forespørgsel |
 |
BFG325/XR,215 | NXP USA Inc. | TRANS NPN 6V 35MA 14GHZ SOT143R | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers