Købe SOMAM3703-31-1780AKIR med BYCHPS
Køb med garanti
SOMAM3703-31-1780AKIR
- Varenummer:
- SOMAM3703-31-1780AKIR
- Fabrikant:
- Logic PD, Inc.
- Beskrivelse:
- SYSTEM ON MODULE WIRELESS TORP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12594 Pieces
- Datablad:
- SOMAM3703-31-1780AKIR.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for SOMAM3703-31-1780AKIR, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til SOMAM3703-31-1780AKIR via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Fart: | 800MHz |
|---|---|
| Serie: | AM37x |
| RAM-størrelse: | 256MB |
| Andre navne: | 460-3525 |
| Driftstemperatur: | -40°C ~ 85°C |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Modul / Board Type: | MPU Core |
| Producentens varenummer: | SOMAM3703-31-1780AKIR |
| Flash størrelse: | 512MB |
| Udvidet beskrivelse: | AM37x Embedded Module ARM® Cortex®-A8, AM3703 800MHz 256MB 512MB |
| Beskrivelse: | SYSTEM ON MODULE WIRELESS TORP |
| Core Processor: | ARM® Cortex®-A8, AM3703 |
| Tilslutningstype: | Board-to-Board (BTB) Socket - 200 |
| Co-processor: | - |
| Email: | [email protected] |
Relaterede dele til SOMAM3703-31-1780AKIR
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
SOMAM3703-30-1780AKIR | Logic | SYSTEM ON MODULE TORP | Forespørgsel |
 |
SOMAM3703-32-1780AKIR | Logic | SOM TORPEDO WIRELESS 800MHZ IND | Forespørgsel |
 |
SOMAM3703-10-2780HFCR | Logic | SYSTEM ON MODULE LV AM3703 | Forespørgsel |
 |
SOMAM3703-20-1780AGCR | Logic | SYSTEM ON MODULE TORP AM3703 | Forespørgsel |
 |
SOMAM3517-10-1780RJXR | Logic | SYSTEM ON MODULE AM3517 | Forespørgsel |
 |
SOMAM3517-10-1780FJCR | Logic | IC SOM AM3517 MODULE | Forespørgsel |
 |
SOMAM3517-10-1780FJIR | Logic | SYSTEM ON MODULE AM3517 | Forespørgsel |
 |
SOMAM3517-10-1780RJCR | Logic | IC SOM AM3517 MODULE | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers