Købe STGIPN3H60A med BYCHPS
Køb med garanti
STGIPN3H60A
- Varenummer:
- STGIPN3H60A
- Fabrikant:
- ST
- Beskrivelse:
- IGBT IPM MODULE 3A 600V NDIP-26L
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19598 Pieces
- Datablad:
- STGIPN3H60A.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for STGIPN3H60A, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til STGIPN3H60A via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Isolering: | 1000VDC |
|---|---|
| Spænding: | 600V |
| Type: | IGBT |
| Serie: | SLLIMM™ |
| Pakke / tilfælde: | 26-PowerDIP Module (0.846", 21.48mm) |
| Andre navne: | 497-12115 |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | STGIPN3H60A |
| Udvidet beskrivelse: | Power Driver Module IGBT 3 Phase 600V 3A 26-PowerDIP Module (0.846", 21.48mm) |
| Beskrivelse: | IGBT IPM MODULE 3A 600V NDIP-26L |
| Nuværende: | 3A |
| Konfiguration: | 3 Phase |
| Email: | [email protected] |
Relaterede dele til STGIPN3H60A
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
STGIPN3H60-H | STMicroelectronics | MOD IGBT SLLIMM NANO 26-NDIP | Forespørgsel |
|
STGIPN3H60T-H | STMicroelectronics | MOD IGBT SLLIMM NANO 26-NDIP | Forespørgsel |
 |
STGIPN3H60AT | STMicroelectronics | IGBT BIPO 600V 3A DIP | Forespørgsel |
 |
STGIPN3H60 | STMicroelectronics | IGBT IPM MODULE 3A 600V NDIP-26L | Forespørgsel |
 |
PS21961-4 | Powerex Inc. | MOD IPM 600V 3A SUPERMINI DIP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers