Købe STGW30NC60KD med BYCHPS
Køb med garanti
STGW30NC60KD
- Varenummer:
- STGW30NC60KD
- Fabrikant:
- ST
- Beskrivelse:
- IGBT 600V 60A 200W TO247
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13694 Pieces
- Datablad:
- STGW30NC60KD.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for STGW30NC60KD, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til STGW30NC60KD via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 600V |
|---|---|
| Vce (på) (Max) @ Vge, Ic: | 2.7V @ 15V, 20A |
| Testtilstand: | 480V, 20A, 10 Ohm, 15V |
| Td (tænd / sluk) @ 25 ° C: | 29ns/120ns |
| Skifte energi: | 350µJ (on), 435µJ (off) |
| Leverandør Device Package: | TO-247-3 |
| Serie: | PowerMESH™ |
| Reverse Recovery Time (trr): | 40ns |
| Strøm - Max: | 200W |
| Emballage: | Tube |
| Pakke / tilfælde: | TO-247-3 |
| Andre navne: | 497-7485-5 STGW30NC60KD-ND |
| Driftstemperatur: | -55°C ~ 150°C (TJ) |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 20 Weeks |
| Producentens varenummer: | STGW30NC60KD |
| Input Type: | Standard |
| IGBT Type: | - |
| Gate Charge: | 96nC |
| Udvidet beskrivelse: | IGBT 600V 60A 200W Through Hole TO-247-3 |
| Beskrivelse: | IGBT 600V 60A 200W TO247 |
| Nuværende - Collector Pulsed (Icm): | 125A |
| Nuværende - Samler (Ic) (Max): | 60A |
| Email: | [email protected] |
Relaterede dele til STGW30NC60KD
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog