Købe TPR700 med BYCHPS
Køb med garanti
TPR700
- Varenummer:
- TPR700
- Fabrikant:
- Microsemi
- Beskrivelse:
- TRANS RF BIPO 2050W 55A 55KT1
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15064 Pieces
- Datablad:
- TPR700.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for TPR700, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til TPR700 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 65V |
|---|---|
| Transistor Type: | NPN |
| Leverandør Device Package: | 55KT |
| Serie: | - |
| Strøm - Max: | 2050W |
| Emballage: | Bulk |
| Pakke / tilfælde: | 55KT |
| Driftstemperatur: | 200°C (TJ) |
| Støjbillede (dB Typ @ f): | - |
| Monteringstype: | Chassis Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | TPR700 |
| Gevinst: | 6.7dB |
| Frekvens - Overgang: | 1.03GHz ~ 1.09GHz |
| Udvidet beskrivelse: | RF Transistor NPN 65V 55A 1.03GHz ~ 1.09GHz 2050W Chassis Mount 55KT |
| Beskrivelse: | TRANS RF BIPO 2050W 55A 55KT1 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 10 @ 1A, 5V |
| Nuværende - Samler (Ic) (Max): | 55A |
| Email: | [email protected] |
Relaterede dele til TPR700
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
UTV010 | Microsemi Corporation | TRANS RF BIPO 15W 1.25A 55FT-5 | Forespørgsel |
 |
NE68130-T1 | CEL | TRANS NPN 1GHZ SOT-323 | Forespørgsel |
 |
CMPT918 TR | Central Semiconductor Corp | TRANS NPN 30V 50MA SOT23 | Forespørgsel |
 |
BFU580QX | NXP USA Inc. | TRANS RF NPN 12V 60MA SOT89-3 | Forespørgsel |
 |
2N2857 | Fairchild/Micross Components | DIE RF TRANS NPN 15V | Forespørgsel |
|
MDS140L | Microsemi Corporation | TRANS RF BIPO 500W 12A 55AW1 | Forespørgsel |
 |
HFA3102BZ96 | Intersil | IC TRANS ARRAY DUAL NPN 14-SOIC | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers