Købe UMIL25 med BYCHPS
Køb med garanti
UMIL25
- Varenummer:
- UMIL25
- Fabrikant:
- Microsemi
- Beskrivelse:
- TRANS RF BIPO 70W 3A 55HV2
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19363 Pieces
- Datablad:
- UMIL25.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for UMIL25, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til UMIL25 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 33V |
|---|---|
| Transistor Type: | NPN |
| Leverandør Device Package: | 55HV |
| Serie: | - |
| Strøm - Max: | 70W |
| Emballage: | Bulk |
| Pakke / tilfælde: | 55HV |
| Driftstemperatur: | 200°C (TJ) |
| Støjbillede (dB Typ @ f): | - |
| Monteringstype: | Chassis Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | UMIL25 |
| Gevinst: | 8.9db ~ 10dB |
| Frekvens - Overgang: | 225MHz ~ 400MHz |
| Udvidet beskrivelse: | RF Transistor NPN 33V 3A 225MHz ~ 400MHz 70W Chassis Mount 55HV |
| Beskrivelse: | TRANS RF BIPO 70W 3A 55HV2 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 10 @ 500mA, 5V |
| Nuværende - Samler (Ic) (Max): | 3A |
| Email: | [email protected] |
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|---|---|---|---|---|
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MDS800 | Microsemi Corporation | TRANS RF BIPO 1458W 60A 55ST1 | Forespørgsel |
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BFU760F,115 | NXP USA Inc. | TRANS RF NPN 2.8V 70MA SOT343F | Forespørgsel |
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BFG424W,115 | NXP USA Inc. | TRANS NPN 10V 30MA SOT343R | Forespørgsel |
|
MS2361 | Microsemi Corporation | TRANS RF BIPO 87.5W 2.6A M115 | Forespørgsel |
 |
BFG520/X,235 | NXP USA Inc. | TRANS RF NPN 9GHZ 15V SOT143B | Forespørgsel |
|
BFU550XRR | NXP USA Inc. | TRANS RF NPN 12V 50MA SOT-143R | Forespørgsel |
 |
BFR520,215 | NXP USA Inc. | TRANS NPN 70MA 15V 9GHZ SOT23 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers