Købe XC1736EPC20I med BYCHPS
Køb med garanti
XC1736EPC20I
- Varenummer:
- XC1736EPC20I
- Fabrikant:
- Xilinx
- Beskrivelse:
- IC PROM SER I-TEMP 36K 20-PLCC
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 13264 Pieces
- Datablad:
- XC1736EPC20I.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for XC1736EPC20I, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til XC1736EPC20I via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 4.5 V ~ 5.5 V |
|---|---|
| Leverandør Device Package: | 20-PLCC (9x9) |
| Serie: | - |
| Programmerbar Type: | OTP |
| Emballage: | Tube |
| Pakke / tilfælde: | 20-LCC (J-Lead) |
| Driftstemperatur: | -40°C ~ 85°C |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Hukommelsesstørrelse: | 36kb |
| Producentens varenummer: | XC1736EPC20I |
| Beskrivelse: | IC PROM SER I-TEMP 36K 20-PLCC |
| Email: | [email protected] |
Relaterede dele til XC1736EPC20I
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
XC1736EPC20C | Xilinx Inc. | IC PROM SER C-TEMP 36K 20-PLCC | Forespørgsel |
 |
XC1736ESO8I | Xilinx Inc. | IC PROM SER I-TEMP 36K 8-SOIC | Forespørgsel |
|
XC1736EPDG8C | Xilinx Inc. | IC PROM SERIAL CONFIG 36K 8-DIP | Forespørgsel |
|
XC1736EVO8C | Xilinx Inc. | IC SER CFG PROM 36K 8-SOIC | Forespørgsel |
|
XC1736EPD8I | Xilinx Inc. | IC PROM SER I-TEMP 36K 8-DIP | Forespørgsel |
|
XC1736ESOG8C | Xilinx Inc. | IC PROM SERIAL CONFIG 36K 8-SOIC | Forespørgsel |
|
XC1736EVO8I | Xilinx Inc. | IC SER CFG PROM 36K 8-SOIC | Forespørgsel |
|
XC1736EVOG8C | Xilinx Inc. | IC PROM SERIAL 36K 8-SOIC | Forespørgsel |
|
XC1736ESO8C | Xilinx Inc. | IC PROM SERIAL CONFIG 36K 8-SOIC | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers