Købe MAX3172EAI+T med BYCHPS
Køb med garanti
MAX3172EAI+T
- Varenummer:
- MAX3172EAI+T
- Fabrikant:
- Maxim Integrated
- Beskrivelse:
- IC TERM/TXRX MULTIPROT 28-SSOP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13155 Pieces
- Datablad:
- 1.MAX3172EAI+T.pdf2.MAX3172EAI+T.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for MAX3172EAI+T, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til MAX3172EAI+T via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 3 V ~ 3.6 V |
|---|---|
| Type: | Transceiver |
| Leverandør Device Package: | 28-SSOP |
| Serie: | - |
| Modtager Hysterese: | 500mV |
| protokol: | RS232 |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 28-SSOP (0.209", 5.30mm Width) |
| Driftstemperatur: | -40°C ~ 85°C |
| Antal drivere / modtagere: | 1/1 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | MAX3172EAI+T |
| Udvidet beskrivelse: | 1/1 Transceiver Full RS232 28-SSOP |
| Duplex: | Full |
| Beskrivelse: | IC TERM/TXRX MULTIPROT 28-SSOP |
| Datahastighed: | 240kbps |
| Email: | [email protected] |
Relaterede dele til MAX3172EAI+T
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers