Købe MAX31730AUB+ med BYCHPS
Køb med garanti
MAX31730AUB+
- Varenummer:
- MAX31730AUB+
- Fabrikant:
- Maxim Integrated
- Beskrivelse:
- IC REMOTE TEMP SENSOR USSOP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13366 Pieces
- Datablad:
- 1.MAX31730AUB+.pdf2.MAX31730AUB+.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for MAX31730AUB+, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til MAX31730AUB+ via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 3 V ~ 3.6 V |
|---|---|
| Leverandør Device Package: | 10-uMAX |
| Serie: | - |
| Emballage: | Tray |
| Pakke / tilfælde: | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 6 Weeks |
| Producentens varenummer: | MAX31730AUB+ |
| grænseflade: | 2-Wire |
| Udvidet beskrivelse: | ASIC, CPU, FPGA Die Temp Monitoring Interface 10-uMAX |
| Beskrivelse: | IC REMOTE TEMP SENSOR USSOP |
| Applikationer: | ASIC, CPU, FPGA Die Temp Monitoring |
| Email: | [email protected] |
Relaterede dele til MAX31730AUB+
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers