Købe 00-023-028/J med BYCHPS
Køb med garanti
00-023-028/J
- Varenummer:
- 00-023-028/J
- Fabrikant:
- Bussmann (Eaton)
- Beskrivelse:
- SCREW BRASS
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13232 Pieces
- Datablad:
- 00-023-028/J.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 00-023-028/J, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 00-023-028/J via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Serie: | * |
|---|---|
| Andre navne: | BS00-023-028-J |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | 00-023-028/J |
| Beskrivelse: | SCREW BRASS |
| Email: | [email protected] |
Relaterede dele til 00-023-028/J
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
00-001-028-32/J | Eaton | INS. BASE ME | Forespørgsel |
|
00-001-035-32/J | Eaton | PLASTIC | Forespørgsel |
|
00-001-171-36/J | Eaton | A1000 B.E. | Forespørgsel |
|
00-001-217-27/J | Eaton | LP3 PLASTIC-FOOTED X-CUT | Forespørgsel |
|
00-001-218-27/J | Eaton | PLASTIC | Forespørgsel |
|
2A1961-1 | Eaton | KIT SPARE FUSE COMPARTMENT TCF 1 | Forespørgsel |
|
00-001-029-30/J | Eaton | A2 CLOSED BASE ME | Forespørgsel |
 |
64000001503 | Littelfuse Inc. | ACS HANDADAPTER FOR 646/647 WHT | Forespørgsel |
 |
1113/71 | APM Hexseal | BOOT ROCKER CIRCUIT BREAKER CLR | Forespørgsel |
|
00970024Z | Littelfuse Inc. | PULLER MINI | Forespørgsel |
|
0495900.Z | Littelfuse Inc. | SHUNT ASSEMBLY JCASE | Forespørgsel |
|
00-001-026-32/J | Eaton | FOOTED BASE BE | Forespørgsel |
|
00-001-033-32/J | Eaton | PLASTIC | Forespørgsel |
|
00970036U | Littelfuse Inc. | FUSE INSERTER | Forespørgsel |
 |
03452LS1HX020 | Littelfuse Inc. | FUSEHOLDER 2AG SCRWDVR SLOT KNOB | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers