Købe 0313.500HXIDP med BYCHPS
Køb med garanti
0313.500HXIDP
- Varenummer:
- 0313.500HXIDP
- Fabrikant:
- Littelfuse
- Beskrivelse:
- FUSE GLASS 500MA 250VAC 3AB 3AG
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16086 Pieces
- Datablad:
- 0313.500HXIDP.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 0313.500HXIDP, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 0313.500HXIDP via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering - DC: | - |
|---|---|
| Spændingsbedømmelse - AC: | 250V |
| Størrelse / Dimension: | 0.250" Dia x 1.250" L (6.35mm x 31.75mm) |
| Serie: | 313 |
| Responstid: | Slow |
| Emballage: | Bulk |
| Pakke / tilfælde: | 3AB, 3AG, 1/4" x 1-1/4" |
| Andre navne: | 0313.500HXIDP-ND 0313500HXIDP 313.500 F4806 |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Holder |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Smeltning I²t: | 2.55 |
| Fabrikantens standard ledetid: | 9 Weeks |
| Producentens varenummer: | 0313.500HXIDP |
| Sikringstype: | Cartridge, Glass |
| Beskrivelse: | FUSE GLASS 500MA 250VAC 3AB 3AG |
| DC Cold Resistance: | 1.26 Ohm |
| Nuværende vurdering: | 500mA |
| Farve: | - |
| Brydeskapacitet @ Nominel spænding: | 35A |
| Godkendelser: | CE, CSA, UL |
| Email: | [email protected] |
Relaterede dele til 0313.500HXIDP
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers