Købe 0831 000 H3M0 560 KLF med BYCHPS
Køb med garanti
0831 000 H3M0 560 KLF
- Varenummer:
- 0831 000 H3M0 560 KLF
- Fabrikant:
- CTS Electronic Components
- Beskrivelse:
- CAP CER 56PF H3M RADIAL
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19221 Pieces
- Datablad:
- 0831 000 H3M0 560 KLF.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 0831 000 H3M0 560 KLF, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 0831 000 H3M0 560 KLF via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | - |
|---|---|
| Tolerance: | ±10% |
| Tykkelse (Max): | - |
| Temperaturkoefficient: | H3M |
| Størrelse / Dimension: | 0.290" Dia (7.37mm) |
| Serie: | - |
| Vurderinger: | - |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Disc |
| Andre navne: | 0831000H3M0560KLF 831000A560KLF |
| Driftstemperatur: | - |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 10 Weeks |
| Producentens varenummer: | 0831 000 H3M0 560 KLF |
| Lead Style: | Straight |
| Blyafstand: | 0.250" (6.35mm) |
| Højde - Siddende (Max): | - |
| Funktioner: | - |
| Fejlrate: | - |
| Udvidet beskrivelse: | 56pF ±10% Ceramic Capacitor H3M Radial, Disc |
| Beskrivelse: | CAP CER 56PF H3M RADIAL |
| kapacitans: | 56pF |
| Applikationer: | General Purpose |
| Email: | [email protected] |
Relaterede dele til 0831 000 H3M0 560 KLF
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog