Købe 0859.0042 med BYCHPS
Køb med garanti
0859.0042
- Varenummer:
- 0859.0042
- Fabrikant:
- Schurter
- Beskrivelse:
- INSULATING COVER FOR FEU
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13802 Pieces
- Datablad:
- 0859.0042.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 0859.0042, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 0859.0042 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Serie: | FEU, FEU (Med) |
|---|---|
| Fabrikantens standard ledetid: | 20 Weeks |
| Producentens varenummer: | 0859.0042 |
| Til brug med / relaterede produkter: | Fuseholder; FEU |
| Beskrivelse: | INSULATING COVER FOR FEU |
| Tilbehørstype: | Cap (Cover) |
| Email: | [email protected] |
Relaterede dele til 0859.0042
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
1PH6P25MM | Littelfuse Inc. | BUSBAR 1 PHASE 6 POLE 25X104MM | Forespørgsel |
|
64000001603 | Littelfuse Inc. | ACS HANDADAPTER FOR 646/647 YLW | Forespørgsel |
 |
0859.0043 | Schurter Inc. | INSULATING COVER FOR FEU | Forespørgsel |
 |
2A1960-3 | Eaton | KIT BRANCH ENCLOSURE 42 | Forespørgsel |
|
2A1912-5 | Eaton | KIT BRANCH LOCKOUT (3M PANELSAFE | Forespørgsel |
|
03540525Z | Littelfuse Inc. | FUSE TERM LOCK TYPE 2 | Forespørgsel |
 |
0859.0041 | Schurter Inc. | INSULATING COVER FOR FEU | Forespørgsel |
|
2A1690-4BK | Eaton | CAN 33 BLANK KNOCKOUT | Forespørgsel |
 |
0859.0046 | Schurter Inc. | INSULATING COVER FOR FIZ/FUL | Forespørgsel |
|
2A1959-2 | Eaton | SKIRT FOR QSCP 28" | Forespørgsel |
 |
12-J20-60 | E-T-A | CIRCUIT BREAKER SOCKET | Forespørgsel |
|
0D0Z14BRZ | Littelfuse Inc. | GAUGE RING FOR 4A D01 FUSE BROWN | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers