Købe 10A060 med BYCHPS
Køb med garanti
10A060
- Varenummer:
- 10A060
- Fabrikant:
- Microsemi
- Beskrivelse:
- TRANS RF BIPO 21W 3A 55FT-2
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17572 Pieces
- Datablad:
- 10A060.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 10A060, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 10A060 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 24V |
|---|---|
| Transistor Type: | NPN |
| Leverandør Device Package: | 55FT |
| Serie: | - |
| Strøm - Max: | 21W |
| Emballage: | Bulk |
| Pakke / tilfælde: | 55FT |
| Driftstemperatur: | 200°C (TJ) |
| Støjbillede (dB Typ @ f): | - |
| Monteringstype: | Stud Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | 10A060 |
| Gevinst: | 8dB ~ 8.5dB |
| Frekvens - Overgang: | 1GHz |
| Udvidet beskrivelse: | RF Transistor NPN 24V 3A 1GHz 21W Stud Mount 55FT |
| Beskrivelse: | TRANS RF BIPO 21W 3A 55FT-2 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 20 @ 400mA, 5V |
| Nuværende - Samler (Ic) (Max): | 3A |
| Email: | [email protected] |
Relaterede dele til 10A060
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
MS2228 | Microsemi Corporation | TRANS RF BIPO 175W 5.4A M214 | Forespørgsel |
 |
BFG520/XR,235 | NXP USA Inc. | TRANS RF NPN 9GHZ 15V SOT143 | Forespørgsel |
 |
NE462M02-T1-AZ | CEL | RF TRANSISTOR NPN SOT-89 | Forespørgsel |
 |
AT-41532-BLKG | Broadcom Limited | TRANS NPN BIPO 12V 50MA SOT-323 | Forespørgsel |
 |
PN918_D74Z | Fairchild/ON Semiconductor | TRANS RF NPN 15V 50MA TO-92 | Forespørgsel |
 |
HFA3127R96 | Intersil | IC TRANS ARRAY 5X NPN 16QFN | Forespørgsel |
 |
2SC4093-A | CEL | RF TRANSISTOR NPN SOT-143 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers