Købe 1206J0630392GFR med BYCHPS
Køb med garanti
1206J0630392GFR
- Varenummer:
- 1206J0630392GFR
- Fabrikant:
- Knowles / Syfer
- Beskrivelse:
- CAP CER 3900PF 63V C0G/NP0 1206
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17529 Pieces
- Datablad:
- 1206J0630392GFR.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 1206J0630392GFR, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 1206J0630392GFR via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 63V |
|---|---|
| Tolerance: | ±2% |
| Tykkelse (Max): | 0.063" (1.60mm) |
| Temperaturkoefficient: | C0G, NP0 |
| Størrelse / Dimension: | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
| Serie: | - |
| Vurderinger: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 1206 (3216 Metric) |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Surface Mount, MLCC |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 8 Weeks |
| Producentens varenummer: | 1206J0630392GFR |
| Lead Style: | - |
| Blyafstand: | - |
| Højde - Siddende (Max): | - |
| Funktioner: | Epoxy Mountable, High Temperature |
| Fejlrate: | - |
| Udvidet beskrivelse: | 3900pF ±2% 63V Ceramic Capacitor C0G, NP0 1206 (3216 Metric) |
| Beskrivelse: | CAP CER 3900PF 63V C0G/NP0 1206 |
| kapacitans: | 3900pF |
| Applikationer: | High Reliability, Automotive |
| Email: | [email protected] |
Relaterede dele til 1206J0630392GFR
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog