Købe 1393762-6 med BYCHPS
Køb med garanti
1393762-6
- Varenummer:
- 1393762-6
- Beskrivelse:
- RELAY GEN PURPOSE
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 16094 Pieces
- Datablad:
- 1393762-6.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 1393762-6, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 1393762-6 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Serie: | * |
|---|---|
| Andre navne: | V23006G1020A 4 V23006G1020A4 |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | 1393762-6 |
| Udvidet beskrivelse: | Relay |
| Beskrivelse: | RELAY GEN PURPOSE |
| Email: | [email protected] |
Relaterede dele til 1393762-6
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
1393761-6 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE | Forespørgsel |
|
1393761-8 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE | Forespørgsel |
|
1393762-7 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE | Forespørgsel |
|
1393761-9 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE | Forespørgsel |
|
1393761-1 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE | Forespørgsel |
|
1393762-3 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE | Forespørgsel |
|
1393760-1 | TE Connectivity Potter & Brumfield Relays | RELAY SOCKET HOLD DOWN SPRING | Forespørgsel |
|
1393762-5 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE | Forespørgsel |
|
1393760-2 | TE Connectivity Potter & Brumfield Relays | RELAY SOCKET HOLD DOWN SPRING | Forespørgsel |
|
1393759-1 | TE Connectivity Potter & Brumfield Relays | RELAY | Forespørgsel |
|
1393759-2 | TE Connectivity Potter & Brumfield Relays | RELAY | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog