Købe 170M7082-G med BYCHPS
Køb med garanti
170M7082-G
- Varenummer:
- 170M7082-G
- Fabrikant:
- Bussmann (Eaton)
- Beskrivelse:
- FUSE 2000A 690V 4BKN/65 AR UC
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14656 Pieces
- Datablad:
- 170M7082-G.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for 170M7082-G, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til 170M7082-G via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Serie: | * |
|---|---|
| Emballage: | Bulk |
| Pakke / tilfælde: | Rectangular, Blade |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 4 Weeks |
| Producentens varenummer: | 170M7082-G |
| Sikringstype: | Square |
| Beskrivelse: | FUSE 2000A 690V 4BKN/65 AR UC |
| Email: | [email protected] |
Relaterede dele til 170M7082-G
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
170M7066 | Eaton | FUSE SQUARE 4KA 690VAC | Forespørgsel |
|
170M7084 | Eaton | FUSE SQUARE 3KA 690VAC | Forespørgsel |
|
170M7085 | Eaton | FUSE SQUARE 3.5KA 690VAC | Forespørgsel |
|
170M7081 | Eaton | FUSE SQUARE 1.6KA 690VAC | Forespørgsel |
|
170M7086 | Eaton | FUSE SQUARE 4KA 690VAC | Forespørgsel |
 |
170M7031 | Eaton | FUSE 1100A 1000V 4SBKN/90 AR | Forespørgsel |
|
170M7082 | Eaton | FUSE SQUARE 2KA 690VAC | Forespørgsel |
|
170M7028 | Eaton | FUSE 3000A 690V 4SBKN/60 AR | Forespørgsel |
|
170M7083 | Eaton | FUSE SQUARE 2.5KA 690VAC | Forespørgsel |
|
170M7043 | Eaton | FUSE 2500A 660V 4PKN/60 AR | Forespørgsel |
|
170M7080 | Eaton | FUSE SQUARE 1.4KA 690VAC | Forespørgsel |
|
170M7084-G | Eaton | FUSE 3000A 690V 4BKN/65 AR UR + | Forespørgsel |
|
170M7063 | Eaton | FUSE SQUARE 2.5KA 690VAC | Forespørgsel |
|
170M7069 | Eaton | FUSE 4000A 380V 4PKN/60 AR | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers